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product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys 1/ 12 tsz02201-0l5l0f300820-1-2 ? 2013 rohm co., ltd. all rights reserved. 14.jul.2016 rev.002 www.rohm.c om tsz22111 ? 14 ? 001 capacitive controller ics capacitive switch controller ic bu21077muv general description bu21077muv is a capacitive switch controller for switch operation. bu21077muv has programmable mpu and it control the sensing sequence and how to use value of sensor. it is possible to reduce operational current with devising a sensing sequence. features programmable m pu 8 capacitive sensor ports 2-wire serial bus interface single power supply built-in power- on -reset and oscillator applications portable device such as smart phone, pda. electronic device with multi switches information appliance such as projector av appliance such as digital tv , hdd recorder pc / pc peripheral equipment such as laptop pc key specifications input voltage range 2.7 to 5.5v operating temperature range -20 to + 85 c package vqfn020v4040 4.00 L 4.00 L 1. 00 L typical application circuit host vdd 1.0uf 2.2uf 1.0uf 4.7k vdd 4.7k 1m bu21077muv sin1 sin0 avdd rstb dvdd vdd vss nc scl sda sin5 sin6 sin7 int test sin2 nc sin4 sin3 nc 15 1620 1 5 6 10 11 figure 1 . typical application circuit datashee t downloaded from: http:///
2/ 12 bu21077muv tsz02201-0l5l0f300820-1-2 ? 2013 rohm co., ltd. all rights reserved. 14.jul.2016 rev.002 www.rohm.c om tsz22111 ? 15 ? 001 pin configurations bu21077muv top view sin1 sin0 avdd rstb dvdd vdd vss nc scl sda sin5 sin6 sin7 int test sin2 nc sin4 sin3 nc 15 1620 1 5 6 10 11 figure 2 . pin configuratio ns pin descriptions pin no. pin name i/o functions note power initial condition i/o equivalent circuit 1 vdd power power - - - 2 vss ground ground - - - 3 nc - - - - - 4 scl in host-i/f scl pin vdd hi -z b 5 sda inout host-i/f sda pin vdd hi -z b 6 int out interrupt output vdd hi -z b 7 test in test input fix l at the normal operation vdd hi -z c 8 sin7 inout sensor 7 avdd hi -z a 9 sin6 inout sensor 6 avdd hi -z a 10 sin5 inout sensor 5 avdd hi -z a 11 nc - - - - - 12 sin4 inout sensor 4 avdd hi -z a 13 sin3 inout sensor 3 avdd hi -z a 14 sin2 inout sensor 2 avdd hi -z a 15 nc - - - - - 16 sin1 inout sensor 1 avdd hi -z a 17 sin0 inout sensor 0 avdd hi -z a 18 avdd power ldo output for analog blocks - - - 19 dvdd power ldo output for digital blocks - - - 20 rstb in reset bar input active l vdd hi -z c i/o equivalent circuits ain asw pad i oen avdd figure 3 . i/o equivalent circuit (a) pad cin i vdd oen figure 4 . i/o equivalent circuit (b) i pad vdd figure 5 . i/o equivalent circuit (c) downloaded from: http:///
3/ 12 bu21077muv tsz02201-0l5l0f300820-1-2 ? 2013 rohm co., ltd. all rights reserved. 14.jul.2016 rev.002 www.rohm.c om tsz22111 ? 15 ? 001 block diagram ldo15 ldo25 vref osc sensor afe c/v converter avdd dvdd sin* logic afe mpu wram vdd vss afe control int wdtr por host i/f test scl sda pram rstb a/d converter figure 6 . block diagram description of blocks sensor afe , c/v converter convert from capacitance to voltage for each sensor. a/d converter convert from analog value to digital value. ldo 25 2.5v output ldo for sensor afe, c/v converter, and a/d converter. ldo15 1.5v output ldo for osc and logic blocks. osc oscillator. por power- on -reset for system reset. mpu control sensor and sequence by program. pram 8kbyte program ram of mpu. it needs to download program from host. wram working ram for mpu. host i/f 2-wire serial bus interface compatible with i2c protocol. afe control control sequencer for sensor afe, c/v converter, and a/d converter. wdtr watchdog timer reset. it issues a reset when the mpu is h ang -upped. downloaded from: http:///
4/ 12 bu21077muv tsz02201-0l5l0f300820-1-2 ? 2013 rohm co., ltd. all rights reserved. 14.jul.2016 rev.002 www.rohm.c om tsz22111 ? 15 ? 001 absolute maximum ratings (ta = 25c) parameter symbol rating unit power supply voltage vdd -0.5 to +7.0 v input voltage v in -0.5 to vdd + 0.3 v operating temperature range t opr - 20 to + 85 c storage temperature range t stg - 55 to + 125 c power dissipation p d 0.55 (note 1) w maximum junction temperature t jmax 125 c (note 1) derate by 5. 5mw/c when operating above ta=25c (mounted in 1-layer 74.2 7 4.21.6mm board with 10.22mm 2 surface capper area) p d of ic is 0.27w and derate by 2.7mw/c when operating above ta =25c. caution: operating the ic over the absolute maximum ratings may damage the ic. t he damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is oper ated over the absolute maximum ratings. recommended operating condition (ta = - 20 to +85c) parameter symbol rating unit power supply voltage vdd 2.7 to 5.5 v electrical characteristics (ta = 25c, vdd = 3.3v, vss = 0v) parameter symbol min typ max unit co nditions input h igh voltage v ih vdd x 0.7 - vdd + 0.3 v input l ow voltage v il vss - 0.3 - vdd x 0.3 v output high voltage v oh vdd - 0.5 - vdd v i oh = -4ma output low voltage v ol vss - vss + 0.5 v i ol = +4ma osc frequency 1 f osc1 45 50 55 mhz osc frequency 2 f osc2 51.2 64 76.8 k hz dvdd voltage v dvdd 1.35 1.50 1.65 v avdd voltage v avdd 2.40 2.50 2.60 v downloaded from: http:///
5/ 12 bu21077muv tsz02201-0l5l0f300820-1-2 ? 2013 rohm co., ltd. all rights reserved. 14.jul.2016 rev.002 www.rohm.c om tsz22111 ? 15 ? 001 host interface bu21077muv has 2-wire serial bus interface. it is compatible with i2c protocol and bu21077muv is a slave device. sl ave address of bu21077muv is 5ch (shown 7-bit). and it supports sta ndard-mode (100 khz) and fast-mode ( 400 khz). it has sequential read for reduce access time. s 1-7 8 9 p 1-7 8 9 1-7 8 9 figure 7 . 2-wire serial bus interface data format sda t low t hd;sta scl repeated start condition t hd;dat t high t hd;sta t su;sta t su;dat t buf t su;sto stop condition start condition start condition figure 8 . 2-wire serial bus interface timing chart parameter symbol standard-mode fast-mode unit min max min max scl clock frequency f scl 0 100 0 400 khz hold time for ( repeated ) start condition t hd;sta 4.0 - 0.6 - s low period of scl t low 4.7 - 1.3 - s high period of scl t high 4.0 - 0.6 - s data hold time t hd;dat 0.1 3.45 0.1 0.9 s data setup time t su;dat 0.25 - 0.1 - s setup time for repeated start condition t su;sta 4 .7 - 0.6 - s setup time for stop condition t su;sto 4.0 - 0.6 - s bus free time between stop and start condition t buf 4.7 - 1.3 - s sda scl start address ack data data ack stop nack / ack r/w downloaded from: http:///
6/ 12 bu21077muv tsz02201-0l5l0f300820-1-2 ? 2013 rohm co., ltd. all rights reserved. 14.jul.2016 rev.002 www.rohm.c om tsz22111 ? 15 ? 001 s a 6 s a 5 s a 4 s a 3 s a 2 s a 1 s a 0 r a 7 r a 6 r a 5 r a 4 r a 3 r a 2 r a 1 r a 0 w d 7 w d 6 w d 5 w d 4 w d 3 w d 2 w d 1 w d 0 s t a r t slave address =0x5c wr i t e a c k a c k a c k s t o p register address (n) write data to register (register address =n) byte write s a 6 s a 5 s a 4 s a 3 s a 2 s a 1 s a 0 r a 7 r a 6 r a 5 r a 4 r a 3 r a 2 r a 1 r a 0 s a 6 s a 5 s a 4 s a 3 s a 2 s a 1 s a 0 s t a r t slave address =0x5c wr i t e a c k a c k n a c k s t o p register address (n) slave address =0x5c random read r d 7 r d 6 r d 5 r d 4 r d 3 r d 2 r d 1 r d 0 read data from register (register address =n) a c k r e a d s a 6 s a 5 s a 4 s a 3 s a 2 s a 1 s a 0 r a 7 r a 6 r a 5 r a 4 r a 3 r a 2 r a 1 r a 0 s a 6 s a 5 s a 4 s a 3 s a 2 s a 1 s a 0 s t a r t slave address =0x5c wr i t e a c k a c k a c k register address (n) slave address =0x5c sequential read r d 7 r d 6 r d 5 r d 4 r d 3 r d 2 r d 1 r d 0 read data from register (register address =n) a c k r e a d s t a r t s t a r t r d 7 r d 0 a c k r d 7 r d 6 r d 5 r d 4 r d 3 r d 2 r d 1 r d 0 read data from register (register address =n+x) n a c k s t o p sa : slave address ra : register address rd : read data wd : write data figure 9 . 2-wire serial bus protocol downloaded from: http:///
7/ 12 bu21077muv tsz02201-0l5l0f300820-1-2 ? 2013 rohm co., ltd. all rights reserved. 14.jul.2016 rev.002 www.rohm.c om tsz22111 ? 15 ? 001 gnd vdd c 2 c 3 c 1 bu 21077 muv vdd vss avdd dvdd power on sequence the power supply pin is only vdd. avdd and dvdd are generated by built -in ldo, these are not necessary to supply from external. when the voltage level of rstb change form low to high after vdd supply ing, ldo is wakeup and dvdd voltage is raised. and built-in power on reset (por) circuit release the syste m reset and host interface is enable after dvdd voltage reach the normal voltage range. rstb pin can not need to be controlled by host and connects to th e vdd, because the bu21077muv has por circuit. if the rstb pin is connected to the vdd, the system reset is release automa tically after vdd supplying. recommended value of external capacitors figure 10 . arrangement of external capacitors vdd rstb dvdd power on reset vdd rstb dvdd power on reset figure 11 . power on sequence (controlled rstb) figure 12 . powe r o n sequence (vdd shorted rstb) c 1 1.0 uf decoupling capacitor for vdd c 2 1.0uf decoupling capacitor for dvdd c 3 2.2uf decoupling capacitor for avdd downloaded from: http:///
8/ 12 bu21077muv tsz02201-0l5l0f300820-1-2 ? 2013 rohm co., ltd. all rights reserved. 14.jul.2016 rev.002 www.rohm.c om tsz22111 ? 15 ? 001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. tak e precautions against reverse polarity when connecting the power supply, such as mounting an external di ode between the power supply and the ic s power supply terminal s. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. s eparate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the ana log block. furthermore, connect a capacitor to ground at all power sup ply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces , the two ground traces should be routed separately but connected to a single ground at the reference point of the appl ication board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground trace s of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute m aximum rating of the pd stated in this specification is wh en the ic is mounted on a 74.2 mm x 74.2mm x 1.6mm glass epoxy board with 10.22 mm 2 copper areas. in case of exceeding this absolute maximum rating, increase the bo ard size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected c haracteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. rush current when power is first supplied to the ic, it is possible that the internal logic may be uns table and inrush current may flow instantaneously due to the internal powering sequence and delays, es pecially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitan ce, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field m ay cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capa citor directly to a low-impedance output pin may subject the ic to stress. always dischar ge capacitors completely after each process or step. the ics pow er supply should always be turned off completely before connecting or rem oving it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic d uring assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other esp ecially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as metal parti cles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. downloaded from: http:///
9/ 12 bu21077muv tsz02201-0l5l0f300820-1-2 ? 2013 rohm co., ltd. all rights reserved. 14.jul.2016 rev.002 www.rohm.c om tsz22111 ? 15 ? 001 operational notes C continued 11. unused input terminals input terminals of an ic are often connected to the gate of a mo s transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the e lectric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spe cified, unused input terminals should be connected to the power supply or ground line. 12. regarding the input pin of the ic in the construction of this ic, p-n junctions are inevitably form ed creating parasitic diodes or transistors. the operation of these parasitic elements can result in mutual interfe rence among circuits, operational faults, or physical damage. therefore, conditions which cause these parasitic e lements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. f urthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the ic. even if the powe r supply voltage is applied, make sure that the input terminals have voltages within the values specified i n the electrical characteristics of this ic. 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric co nstant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias a nd others. downloaded from: http:///
10 / 12 bu21077muv tsz02201-0l5l0f300820-1-2 ? 2013 rohm co., ltd. all rights reserved. 14.jul.2016 rev.002 www.rohm.c om tsz22111 ? 15 ? 001 ordering information b u 2 1 0 7 7 m u v - e 2 part number package muv : vqfn020v4040 packaging and forming specification e2: embossed tape and reel marking diagram vqfn020v4040 (top view) 21077 part number marking lot number 1pin mark b u downloaded from: http:///
11 / 12 bu21077muv tsz02201-0l5l0f300820-1-2 ? 2013 rohm co., ltd. all rights reserved. 14.jul.2016 rev.002 www.rohm.c om tsz22111 ? 15 ? 001 physical dimension, tape and reel information package name vqfn020v4040 downloaded from: http:///
12 / 12 bu21077muv tsz02201-0l5l0f300820-1-2 ? 2013 rohm co., ltd. all rights reserved. 14.jul.2016 rev.002 www.rohm.c om tsz22111 ? 15 ? 001 revision history date revision changes 29.aug.2013 001 new release 14 .jul.2016 002 p3 correct clerical error (old) mup (new) mpu p7 correc t recommended value of decoupling capacitor for vdd (old) 0.1uf (new) 1.0uf downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufactured for application in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremely h igh reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecraft, nuclear powe r controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ( specific applications ), please consult with the rohm sales representative in adv ance. unless otherwise agreed in writing by rohm in advance, rohm s hall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arisin g from the use of any rohm s products for specific applications. (note1) medical equipment classification of the specific appl ications japan usa eu china class class class b class class class 2. rohm designs and manufactures its products subject to stri ct quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequ ate safety measures including but not limited to fail-safe desig n against the physical injury, damage to any property, whic h a failure or malfunction of our products may cause. the followi ng are examples of safety measures: [a] installation of protection circuits or other protective devic es to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified be low. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from th e use of any rohms products under any special or extraordinary environments or conditions. if yo u intend to use our products under any special or extraordinary environments or conditions (as exemplified belo w), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be n ecessary: [a] use of our products in any types of liquid, including water, oils, chemicals, and organi c solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products are e xposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed t o static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing component s, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subject to radiation-proof design. 5. please verify and confirm characteristics of the final or mou nted products in using the products. 6 . in particular, if a transient load (a large amount of load appl ied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mou nting is strongly recommended. avoid applying power exceeding normal rated power; exceeding the power rating u nder steady-state loading condition may negatively affec t product performance and reliability. 7 . de -rate power dissipation depending on ambient temperature. wh en used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8 . confirm that operation temperature is within the specified range desc ribed in the product specification. 9 . rohm shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlorine, bromine, etc .) flux is used, the residue of flux may negatively affect prod uct performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method mus t be used on a through hole mount products. i f the flow soldering method is preferred on a surface-mount p roducts , please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
notice-p ga -e rev.003 ? 201 5 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, p lease allow a sufficient margin considering variations o f the characteristics of the products and external components, inc luding transient characteristics, as well as static characteristics. 2. you agree that application notes, reference designs, and a ssociated data and information contained in this docum ent are presented only as guidance for products use. therefore, i n case you use such information, you are solely responsible for it and you must exercise your own independ ent verification and judgment in the use of such information contained in this document. rohm shall not be in any way respon sible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such informat ion. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take pr oper caution in your manufacturing process and storage so t hat voltage exceeding the products maximum rating will not be applied to products. please take special care under dry co ndition (e.g. grounding of human body / equipment / solder iro n, isolation from charged objects, setting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriorate i f the products are stored in the places where: [a] the products are exposed to sea winds or corrosive gases, in cluding cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to direct sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage condition, solderabil ity of products out of recommended storage time period may be degraded. it is strongly recommended to confirm so lderability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the correct direction, which is indi cated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a c arton. 4. use products within the specified time after opening a humi dity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage tim e period. precaution for product label a two-dimensional barcode printed on rohm products label is f or rohm s internal use only. precaution for disposition when disposing products please dispose them properly usi ng an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to appl ication example contained in this document is for reference only. rohm does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, a ctions or demands arising from the combination of the products with other articles such as components, circuits, systems or ex ternal equipment (including software). 3. no license, expressly or implied, is granted hereby under any inte llectual property rights or other rights of rohm or any third parties with respect to the products or the information contai ned in this document. provided, however, that rohm will not assert it s intellectual property rights or other rights against you or you r customers to the extent necessary to manufacture or sell products containing the products, subject to th e terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whole or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, includi ng but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 2015 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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